Guy Hudson - 1.     U.S. Patent #5,650,619.  "Quality Control Method for Detecting Defective Polishing Pads used in Chemical-Mechanical Planarization of Semiconductor Wafers

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      Publication Details (including relevant citation   information): 1. U.S. Patent #5,650,619. "Quality   Control Method for Detecting Defective Polishing Pads used in   Chemical-Mechanical Planarization of Semiconductor Wafers." 7/97.   2. U.S. Patent #5,679,169. "Method for Post Chemical-Mechanical   Planarization Cleaning of Semiconductor Wafers." 10/97. 3. U.S.   Patent #5,698,455. "Method for Predicting Process Characteristics   of Polyurethane Pads." 12/97. 4. U.S. Patent #5,798,302. "Low   Friction Polish-stop Stratum for Endpointing." 8/98. 5. U.S.   Patent #5,825,028. "Quality Control Method for Detecting   Defective Polishing Pad Used in Planarization of Semiconductor   Wafers." 10/98 6. U.S. Patent #5,830,806. "Wafer Backing Member   for Mechanical and Chemical Mechanical Planarization of   Substrates." 11/98 7. U.S. Patent #5,838,445. "Method and   Apparatus for determining Surface Roughness." 11/98 8. U.S.   Patent #5,849,091. "Megasonic Cleaning Methods and Apparatus."   12/98. 9. U.S. Patent #5,956,612. "Trench/hole Fill Process for   Semiconductor Fabrication." 9/99 10. U.S. Patent #5,972,792.   "Method for chemical-;mechanical planarization of semiconductors   using a fixed abrasive pad." 10/99 11. U.S. Patent #6,006,765.   "Megasonic Cleaning Methods and Apparatus." 12/99. 12. U.S.   Patent #6,048,405. "Megasonic Cleaning Methods and Apparatus."   4/00. 13. U.S. Patent #6,057,602. "Low Friction Polish-Stop   Stratum.". 5/00. 14. U.S. Patent #6,062,952. "Planarization   Process with Abrasive Polishing Slurry that is Selective to a   Planarized Surface." 5/00. 15. U.S. Patent #6,103,636. "Method   and Apparatus for Selective removal of Wafer Alignment Marks".   8/00. 16. U.S. Patent #6,114,706. "Method and Apparatus for   Predicting Process Characteristics of Polyurethane Pads." 9/00.   17. U.S. Patent #6,200,901. "Polishing Polymer Surfaces on   Non-porous CMP Pads. 3/01. 18. U.S Patent #6,220,934. "Method for   controlling pH during planarization and cleaning of   microelectronic substrates." 4/01.

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