Guy Hudson - 19.     U.S. Patent # 6,273,101.  "Method for post CMP cleaning of semiconductor wafers."  8/01. 20.     U.S. Patent #6,329,301.  "Method and apparatus for selective removal of material from wafer alignment marks

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      Publication Details (including relevant citation   information): 19. U.S. Patent # 6,273,101. "Method for   post CMP cleaning of semiconductor wafers." 8/01. 20. U.S. Patent   #6,329,301. "Method and apparatus for selective removal of   material from wafer alignment marks. 12/01. 21. U.S. Patent   #6,368,194. "Apparatus for controlling pH during planarization   and cleaning of microelectronic substrates." 4/02 22. U.S. Patent   #6,379,225. "Planarization process with abrasive slurry that is   selective to a planarized surface" 4/02 23. U.S. Patent   #6,440,319. "Method and apparatus for predicting process   characteristics of polyurethane pads." 8/02 24. U.S. Patent   #6,593,657. "Contact Integration article". 7/03 25. U.S. Patent   #6,610,610. "Methods for selective removal of material from   wafter alignment marks." 8/03 26. U.S. Patent #6,635,574. "Method   of removing material from a semiconductor substrate." 10/03 27.   U.S. Patent #6,640,816. "Method for post chemical-mechanical   planarization cleaning of semiconductor wafers". 11/03 28. U.S.   Patent #6,713,384. "Contact Integration Method". 3/04 29. U.S.   Patent #6,716,089. "Method for controlling pH during   planarization and cleaning of microelectronic substrates." 4/04   30. U.S. Patent #6,794,289. "Method and apparatuses for making   and using bi-modal abrasive slurries for mechanical   chemical-mechanical planarization". 9/04. 31. U.S. Patent   #6,803,316. "Method of planarizing by removing all or part of an   oxidizable material layer from a semiconductor substrate..".   10/04. 32. U.S. Patent #6,889,698. "Apparatus for selective   removal of material from wafer alignment marks." 5/05. 33. U.S.   Patent #6,913,523. "Method for controlling pH during   planarization and cleaning of microelectronic substrates." 7/05   34. U.S. Patent #7,045,017. "Method for post chemical-mechanical   planarization cleaning of semiconductor wafers." 5/06 35. U.S.   Patent #7,122,475. "Methods for using bi-modal slurries for   mechanical and chemical-mechanical planarization of   microelectronic-d

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