Publication Details (including relevant citation information): "Challenges of Electroplated Copper Films and Device Characteristics for Copper Slurry Design", M. Peterson, R. Small, and T. Truong; The 1999 Joint International ECS Meeting, Hawaii, Oct. 17-22, 1999 "Achieving Reduced Water Consumption during Copper Post CMP Cleaning", R. Small, Z. Chen, O. Leonte, and G. Shaw; The 1999 Joint International ECS Meeting, Hawaii, pp. 112-17, Oct. 17-22, 1999 "Advance Material and Chemistries for CMP Processing", B. Small, M. Peterson and Z. Chen; CMP World "99, San Jose, CA, Nov. 1-3, 1999 Invited Speaker. "Dissolution of Copper and Tantalum Films in Hydroxylamine Based Silica Slurries Under CMP Conditions" W. Huang, S. Raghavan, B. Small, and M. L. Peterson in Chemical Mechanical Planarization in IC Device Manufacturing III, R. L. Opila, etc. Editors, PV 99-37, p. 101 The Electrochemical Society Proceedings Series, Pennington, NJ (1999). "Challenges of ECD Cu Film Variation for Cu Slurry Design", M. Peterson, R. Small, J-Y Lee, T. Truong; Semiconductor FabTech 11 Edition, p.285, 2000 "CMP Processes for Noble Metals and Metal Oxides", G. Beitel, R. Schnabel, G. Mainka, A. Sanger, C. Dehm, R. Small and Z. Chen; 5th International CMP-MIC Conference, Santa Clara, CA. March 2, 2000, p 33.