Robert Small - "Challenges of Electroplated Copper Films and Device Characteristics for Copper Slurry Design", M. Peterson, R. Small, and T. Truong; The 1999 Joint International ECS Meeting, Hawaii, Oct

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      Publication Details (including relevant citation   information): "Challenges of Electroplated Copper Films   and Device Characteristics for Copper Slurry Design", M.   Peterson, R. Small, and T. Truong; The 1999 Joint International   ECS Meeting, Hawaii, Oct. 17-22, 1999 "Achieving Reduced Water   Consumption during Copper Post CMP Cleaning", R. Small, Z. Chen,   O. Leonte, and G. Shaw; The 1999 Joint International ECS Meeting,   Hawaii, pp. 112-17, Oct. 17-22, 1999 "Advance Material and   Chemistries for CMP Processing", B. Small, M. Peterson and Z.   Chen; CMP World "99, San Jose, CA, Nov. 1-3, 1999 Invited   Speaker. "Dissolution of Copper and Tantalum Films in   Hydroxylamine Based Silica Slurries Under CMP Conditions" W.   Huang, S. Raghavan, B. Small, and M. L. Peterson in Chemical   Mechanical Planarization in IC Device Manufacturing III, R. L.   Opila, etc. Editors, PV 99-37, p. 101 The Electrochemical Society   Proceedings Series, Pennington, NJ (1999). "Challenges of ECD Cu   Film Variation for Cu Slurry Design", M. Peterson, R. Small, J-Y   Lee, T. Truong; Semiconductor FabTech 11 Edition, p.285, 2000   "CMP Processes for Noble Metals and Metal Oxides", G. Beitel, R.   Schnabel, G. Mainka, A. Sanger, C. Dehm, R. Small and Z. Chen;   5th International CMP-MIC Conference, Santa Clara, CA. March 2,   2000, p 33.

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