Robert Small - "4th Generation W Slurry for Plug and Damascene Applications", M. Peterson, B. Tredinnick and R. Small; 5th International CMP-MIC Conference, Santa Clara, CA

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      Publication Details (including relevant citation   information): "4th Generation W Slurry for Plug and   Damascene Applications", M. Peterson, B. Tredinnick and R. Small;   5th International CMP-MIC Conference, Santa Clara, CA. March 3,   2000 "Post Clean Treatment for Reduced Water Consumption and   Metal Corrosion on VLSI Structures", R. Small, Z. Chen, C. Wang,   B. Hon; 19th Semiconductor Pure Water and Chemical Conference.   Santa Clara, CA, Mar. 14, 2000 "The Continuing Challenge for Wet   Chemistries", R. Small; 19th Semiconductor Pure Water and   Chemical Conference, Santa Clara, CA, Mar. 14, 2000 "Water   Conservation for post CMP Cleaning: A Growing Concern", R. Small,   Z. Chen, A. Flores, L. McGhee, M. Peterson; Cleanroom Technology,   April, 2000, p. 19-21 "Copper Removal in Hydroxylamine Based   Slurries", W. Huang, S. Raghavan, B. Small and M. Peterson, 7th   International Symposium, SCP, Boise, ID, May 2000 "Extended Uses   of New post CMP Chemistries", B. Small, Z. Chen, C. Wang, CMPUG,   Hayward, CA, June 7, 2000 "Current Studies Involving Next   Generation Chemistries Enabling Advanced Low-k (FOx) Integration   on sub 0.25 micron Structures", R. Small, S. Lee, D-L Zhou, B.   Patel, Dielectric Materials Update 2000, June 8, 2000,   Burlingame, CA. "CMP Waste Water Treatment, Part 2", J. Golden,   R. Small, L. Pagan, C. Shang; 17th International VMIC Conference,   June 29, 2000, Santa Clara, CA "Patterning of Noble Metal   Electrodes and Oxygen Barriers by CMP"; R. F. Schnabel, G.   Beitel, G. Mainka, A. Sanger, P. Bosk, Z. Chen, R. Small, C.   Dehm; Intergrated Ferroelectics, 31(1-4) pp. 233-40, April 2000,   Gordon & Breach Publishing Group. "Reduced Water Consumption   for Post Clean Treatment and Metal Ion Contamination on VLSI   Structures"; R. Small, Z. Chen, C. Wang, B. Hon, UCPSS 2000, p.   81, Sept. 18-20, 2000, Ostend, Belgium (Diffusion and Defect Data   Part B (Solid State Phenomena), 76-77 p. 97-100 (2000). "The   Effect of DI Water and Intermediate Rinse Solutions on Post Metal   Etch Residue Removal Using Semi-Aqueous Cleanin

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