Ronald Wake - "Evaluation of Commercialized Slurries and Pads for Polymer CMP (Chemical Mechanical Polishing)", Fan Zhang, Ronald W. Wake, Lee Cook, and Ahmed A. Busnaina, Proc

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      Publication Details (including relevant citation   information): "Evaluation of Commercialized Slurries and   Pads for Polymer CMP (Chemical Mechanical Polishing)", Fan Zhang,   Ronald W. Wake, Lee Cook, and Ahmed A. Busnaina, Proc. CMP in   Integrated Circuit Device Manufacturing (Electrochemical   Society), 246-254 (1998).

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