Ronald Wake - "Evaluation of Commercialized Slurries and Pads for Polymer CMP (Chemical Mechanical Polishing)", Fan Zhang, Ronald W. Wake, Lee Cook, and Ahmed A. Busnaina, Proc

Document created by Ronald Wake on Aug 22, 2014
Version 1Show Document
  • View in full screen mode

  Publication Details (including relevant citation   information): "Evaluation of Commercialized Slurries and   Pads for Polymer CMP (Chemical Mechanical Polishing)", Fan Zhang,   Ronald W. Wake, Lee Cook, and Ahmed A. Busnaina, Proc. CMP in   Integrated Circuit Device Manufacturing (Electrochemical   Society), 246-254 (1998).

  Abstract: null

  Address (URL):

 

Attachments

    Outcomes