Publication Details (including relevant citation information):
Mariana Amorim Fraga, Matteo Bosi and Marco Negri (2015). Silicon Carbide in Microsystem Technology — Thin Film Versus Bulk Material, Advanced Silicon Carbide Devices and Processing, Dr. Stephen Saddow (Ed.), ISBN: 978-953-51-2168-8, InTech, DOI: 10.5772/60970. Available from: http://www.intechopen.com/books/advanced-silicon-carbide-devices-and-processing/ silicon-carbide-in-microsystem-technology-thin-film-versus-bulk-material
This chapter looks at the role of silicon carbide (SiC) in microsystem technology. It starts with an introduction into the wide bandgap (WBG) materials and the properties that make them potential candidates to enable the development of harsh environment microsystems. The future commercial success of WBG microsystems depends mainly on the availability of high-quality materials, well-established microfabrication processes, and economic viability. In such aspects SiC platform, in relation to other WBG materials, provides a clear and competitive advantage. The reasons for this will be detailed. Furthermore, the current status of the SiC thin film and bulk material technologies will also be discussed. Both SiC material forms have played important roles in different microsystem types.