Mariana Fraga - Studies on SiC, DLC and TiO2 thin films as piezoresistive sensor materials for high temperature application

Version 1

      Publication Details (including relevant citation   information):

      Fraga, M. A.; Furlan, H.; Pessoa, R. S.; Rasia, L. A.; Mateus, C.   F. R. MICROSYSTEM   TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROC;   v. 18, p. 1027-1033, AUG 2012

      Abstract:

        The use of thin films as sensing elements for microsensor   applications has been shown very attractive due to their low-cost   fabrication, potential for integration with standard CMOS   technologies and possibility of deposition on different substrate   types. In particular, piezoresistive sensors based on thin films   have been commonly developed because can be easily implemented   using microfabrication processes and present the best relation   between sensitivity and system complexity, which showing great   advantages in term of device integration. In our previous works   (Fraga et al. 2010, 2011a),   we studied undoped and nitrogen-doped PECVD a-SiC thin films as   alternative materials to replace the silicon piezoresistors in   strain and pressure sensors for harsh environments. Here, we   focused our attention on the piezoresistive properties of   sputtered silicon carbide (SiC), diamond-like carbon (DLC) and   titanium dioxide (TiO2)   thin films. These materials were evaluated in terms of   sensitivity or gauge factor and of the influence of the   temperature on this sensitivity, allowing a preliminary analysis   of the applicability of these thin films in high temperature   piezoresistive sensors.

      Address (URL): http://link.springer.com/article/10.1007%2Fs00542-012-1435-y