Fiona Case

Still open for poster submisions: TechConnect World Innovation Conference, June 14-18, Washington DC

Discussion created by Fiona Case on Feb 2, 2015

The TechConnect World Innovation Conference is still open for poster submissions (deadline Feb 27). If your research is applications focused and might be of interest to companies, or you want to learn more about industrial research needs and funding opportunities - particularly through the SBIR/STTR programs, consider joining us in Washington DC, June 14-18. Check out the program for the following areas:

Advanced Materials, Advanced Manufacturing, Energy & Sustainability, Electronics & Microsystems, Biotech, Medical & Pharma, Personal & Home Care, Cosmetics, Foods. If you have any questions about the event, please feel free to contact me: Fiona Case, Technical Program Chair, TechConnect World Innovation Conference, fcase@nsti.org.

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